OEM Embedded Hardware
Compatibility Matrix
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ASICs
The mobilityIC™ Family
Socket develops chip technology to enhance product capability and performance for mobile connectivity solutions. Our proprietary card interface ICs are known as the mobilityIC™ family. These chips provide the cost effective and feature rich advantage utilized by many of Socket’s Mobility Friendly™ products.
The mobilityICs are made available to qualified manufacturers for inclusion in their products. This provides our customers with many benefits:
- Reduced development costs
- Condensed development schedule
- A common interface across different technologies
- Mobility Friendly features such as minimal power consumption and low component count.
ESG offers mobilityIC development kits, supplying engineering services, support and manufacturing expertise to bring products to market expeditiously.
mobilityIC™ Dual Port: mDP
P/N 2060-00008: TQFP-80, 10x10x1 mm
Recommended for new designs
P/N 2060-00006: TQFP-80, 12x12x1 mm
Used by existing designs
The mDP provides a dual channel interface between computer systems with support for CF or PC Cards to serial peripherals. The mDP supports a superset of the standard IBM PC-compatible 16C450/16C550 UART.
mobilityIC™ Single Port: mSP
P/N 2060-00009: TQFP-80, 10x10x1 mm
Offering a single serial channel which interfaces to CF or PC Card busses, the mSP is a subset of the mobilityIC Dual Port (mDP) features and functions.
mobilityIC™ IO+Memory: mIO
P/N 2060-00005: BGA-100, 11x11x1 mm
The mIO provides an interface between computer systems with CF/PC Card support to mass storage flash memory devices featuring either a MultiMediaCard (MMC) and/or Secure Digital Memory Card (SDMC) interface.
To qualify for mobilityIC use, manufacturers must agree to implement solutions which are non-competitive to Socket’s products and execute a Non-Disclosure Agreement. Designs must be submitted through the Qualification Form process and are subject to approval by Socket.
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